#Laser Micromachining #Advanced Semiconductor Packaging #Fan-Out Wafer-Level Packaging (FOWLP) #Panel-Level Packaging (PLP) #Optical Glass #TGV Technology #TGV Applications

Hortech utilizes advanced laser cutting technology to fabricate glass wafers, including 2-inch (50 mm) wafers.

Through its proprietary laser modification technology and optimized process integration, Jing Code enables superior post-processing performance in etching and polishing. This approach also significantly improves die singulation yield rates for advanced semiconductor packaging applications.