Laser Micro-Drilling Equipment
Laser micro-drilling is widely used in precision manufacturing applications, with increasing demand for smaller, thinner, and higher-density designs. Applications include micro through-holes and blind vias for flexible circuit boards, advanced flexible substrates used in microprocessors, through-hole drilling for thermal ceramic substrates, drilling and slot formation on silicon-based materials, ultra-precision drilling for semiconductor ceramic probe cards, and high-density micro-drilling for advanced 3D semiconductor packaging.
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Femtosecond DUV Laser Micro-Drilling Machine
This system utilizes commercially proven femtosecond ultrashort-pulse laser technology to achieve non-thermal processing. By combining deep ultraviolet (DUV) wavelengths with high photon energy and strong material absorption characteristics, the system generates photochemical reactions that effectively minimize thermal effects during processing.
These advantages enable ultra-fine drilling with minimal heat impact.
The system adopts a scanning-positioning drilling method capable of large-area stitching and precise formation of customized through-holes and blind vias with flexible pattern design capability. It is especially suitable for precision processing of non-standard hole patterns and customized applications.
This machine is particularly suitable for custom drilling development and high-mix low-volume production. Processing parameters, laser control, and motion settings can be optimized according to customer-specific pattern and quality requirements.
The selected laser source provides extremely high photon energy density for high-quality processing performance. Combined with process optimization and integrated motion control, the system delivers precise and reliable manufacturing capability.
Product Features
- Femtosecond ultrashort-pulse laser
- Deep ultraviolet (DUV) photochemical processing
- Capable of processing various materials
- Small focused laser spot size
- High positioning accuracy
Applications
- Stable cold-processing production
- Suitable for most organic and inorganic thin materials
- Low particle generation and reduced thermal effects
#Cold Laser Micro-Drilling #Non-Thermal Laser Micro-Drilling
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Roll-to-Roll (R2R) Laser Micro-drilling Machine for FPC
As many modern products increasingly adopt lightweight and flexible materials such as PI, PET, epoxy, and COP, Hortech has developed this laser area micro-drilling production system for high-volume manufacturing applications.
Circuit substrates made from insulating materials require high-quality conductive vias with low thermal impact, dust-free processing, and high precision. Semiconductor applications further demand extremely small via diameters and pitches, reaching micron-level dimensions.
With the rapid growth of compact semiconductor devices, the required number of microvias has increased significantly. Conventional scanning processing is suitable for irregular hole patterns and prototype production, while mask-based area processing provides superior cost efficiency for high-density, repetitive hole arrays and mass production applications.
Advanced semiconductor packaging requires ultra-high-density micron-scale through-holes. Jing Code’s customized and production-standard systems are designed to meet the requirements of advanced 3D semiconductor packaging. The system has successfully demonstrated 5 μm microhole fabrication and can be further customized according to customer requirements.
Wearable consumer electronics and compact 3C products increasingly require lightweight flexible circuit substrates with high-density conductive vias, including advanced microprocessor substrates. With the growth of wearable technologies and emerging metaverse applications, manufacturing systems must provide both high quality and high design flexibility to support rapidly changing product development requirements.
Product Features
- Micron-level hole diameter and pitch
- Submicron positioning precision
- Cost-effective mass production capability
- Stable high-yield performance
Applications
- Through-holes for advanced 3D semiconductor packaging
- Circuit substrates for wearable devices
- Glass substrates
- Flexible circuit boards
#Excimer Mask-Based Processing #Excimer Direct Writing #Micro-Drilling for 3D Packaging #Micro-Drilling for Flexible Circuit Boards
