Laser micro-cutting enables ultra-fine cutting widths, maximizing material utilization and increasing product yield while reducing manufacturing costs. Materials processed with this technology are often high-value materials that require precision microfabrication, minimized cutting paths, and high-quality processing without thermal damage or cracking.

This micro-cutting technology utilizes high-energy laser processing to achieve high-aspect-ratio focused cutting. With a small focal spot size and extended focal depth, the process delivers excellent cutting quality, minimal processing stress, and stable machining performance. It is therefore especially suitable for thin, hard, and brittle materials, as well as applications requiring cold processing without stress-induced cracks.

#Micron-Level Laser Cutting #Laser Micro-Cutting of SiC Single-Crystal Heat Spreaders

• Silicon Carbide Micro-Laser Engraving

Precision laser engraving and alignment marking for silicon carbide (SiC) wafers.

#Laser Micro-Engraving #Silicon Carbide (SiC) #Wafer Engraving