Wafer Micro-Cutting and Wafer Laser Opening

This system uses DUV ultrafast laser technology to remove photoresist from heterogeneous materials without damaging the underlying silicon wafer. Plasma cutting is then applied to achieve vertical wafer dicing with smooth cutting edges, and can also directly process thin wafers.

Compared with conventional UV laser cutting and IR stealth dicing technologies, DUV ultrafast laser micro-cutting provides lower particle generation, reduced thermal effects, and higher cutting quality for thin wafers.

The process can be combined with protective liquid coatings or protective films to minimize dust contamination during wafer cutting.

Applications:

• Wafer Dicing

• Vertical Plasma Wafer Cutting

• Wafer Laser Opening

• Photoresist Micro-Etching