#Micron-Level Laser Drilling #Laser Micro-Drilling #Laser Hole Drilling #Laser Via Formation #Through-Holes #Blind Vias #Tapered Holes #Buried Vias

Laser micro-drilling enables the fabrication of hole diameters below several tens of micrometers with minimal mechanical stress. Unlike conventional mechanical drilling, which introduces high processing stress, laser micro-drilling is especially suitable for hard and brittle materials as well as irregularly shaped holes.

When micron-level machining precision is required, laser micro-drilling becomes an essential technology for manufacturing MEMS and other advanced micro-scale components. Its applications include 3D semiconductor packaging, advanced flexible substrates, PI inkjet films, medical micro-porous filters, and other high-precision industrial components.