Hortech’s TGV Laser Modification Technology: Addressing the Million-Hole Challenge in the AI Era. As the demand for I/O density in AI and high-performance computing (HPC) chips escalates, Glass Core Substrates have become a critical component in Advanced Packaging. However, despite its superior electrical properties, glass is inherently fragile and brittle. This poses a significant challenge for the TGV (Through Glass Via) process: how to stably process millions of micro-vias in a shor...