Hortech Company
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886-35794266

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      • Micron-Scale Laser Technology
      • Wafer Fabrication & Advanced Semiconductor Packaging
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  • Micron-Scale Laser Technology

Products

  • Applications
    • Micron-Scale Laser Technology
      • Precision Laser Micro-Drilling
      • Micro-scale Laser Engraving
      • Precision Laser Micro-Etching
    • Wafer Fabrication & Advanced Semiconductor Packaging
      • Composite Ceramic ABF Substrate
      • GLASS WAFER
      • SIC wafer
      • Gas Distribution Plate
      • Molybdenum Microhole Plates
      • Profile Cutting of Carbon/Ceramic/Glass Fiber Composites
      • High-efficiency aluminum heat spreader
      • Indium Thermal Interface Material (sTIM)
      • DUV Applications
  • Laser Equipment
    • Water-jet Laser Cutting and Drilling Machine
    • Thin Film Laser Micro-Etching Equipment
    • Laser Micromachining
    • Laser Micro-Drilling Equipment
    • Green Laser Equipment
    • Desktop Laser Engraver
    • UV laser engraving module
    • CO2 Laser Engraving Machine
    • Laser Micromachining System / Equipment
  • Laser Processing Services
    • Precision Micro-Etching
      • Laser-engraved QR code
      • Micro-scale Laser Engraving
      • Laser-engraved Barcode
    • Rigid-Flex PCBs
      • Laser micro-etching on Nickel-Chromium coated ceramics
      • PI Laser Micro-drilling
    • Linear Encoders
      • Encoder disc
      • Stainless steel linear encoder
      • Stainless steel encoder disk
  • Automated Production Line Integration
    • Automated Production Line Installation and Engineering Services

Micron-Scale Laser Technology

View:
Precision Laser Micro-Drilling

Precision Laser Micro-Drilling

Micro-scale Laser Engraving

Micro-scale Laser Engraving

Precision Laser Micro-Etching

Precision Laser Micro-Etching

  • Hortech Company

TEL: 886-35794266

  • Address:1F., No. 13, Yanfa 2nd Rd., East Dist., Hsinchu City 30076, Taiwan
  • E-mail:e-sales@hortek.com.tw
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