Laser Micro-Etching Equipment

Laser micro-etching equipment enables surface patterning on multilayer materials to produce functional components and thick- or thin-film conductive devices.

The technology utilizes differences in laser absorption between surface layers and substrate materials to selectively remove surface material while minimizing damage to the underlying substrate. It is commonly used for conductive thick- and thin-film circuit patterning, with conductivity variations used to verify successful micro-etching.

By precisely controlling etching depth and width while reducing edge defects and burr formation, the process maintains high-quality machining performance.

Micro-etched circuits can be applied in the manufacturing of active and passive components as well as composite material processing to create high value-added products.

• Thin Film Laser Micro-Etching Equipment

• Thick-Film Laser Micro-Etching Equipment

This professional laser micro-etching system is designed for patterned substrate fabrication on thick-film materials.

Laser micro-etching of thick films often generates particles and dust, which can reduce production yield, especially in precision laser processing applications. To address this issue, the system utilizes patented inverted processing technology that positions the processing surface facing downward.

This allows particles generated during laser micro-etching to naturally fall away due to gravity, preventing contamination on the product surface and eliminating the need for additional cleaning after processing.