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About Us
Hortech was admitted to the Hsinchu Science Park in 2016. In its early stage, the company focused on the design and development of laser equipment systems. In 1989, it successfully developed carbon film resistor laser trimming equipment for a major PCB manufacturer, which was applied to memory modules.
In 2009, the company successfully developed a laser dry-process narrow-border circuit scribing system for touch panels, which was mass-produced and sold to leading global touch panel manufacturers.
In 2011, it developed a dual-stage touch panel film narrow-border circuit laser patterning system for a world-leading touch panel manufacturer, enabling higher-precision processing of flexible touch sensor substrates.
In 2015, the company successfully developed a 0.42 mm DITO glass laser patterning system, which was sold to a global navigation device manufacturer.
At the end of 2015, a 6 kW laser robotic additive system was delivered to the Laser Application Center of the Industrial Technology Research Institute (ITRI), Taiwan.
In 2017, the company developed a three-wavelength hybrid laser processing system for a Singapore-based client.
In 2018, it developed a medical PCB traceability laser marking system for a Taiwanese PCB manufacturer.
In 2025, the company achieved mass production of a hub-scale (rotary optical encoder) with an angular precision of 10 arcseconds.
Hortech is also actively involved in the development of advanced semiconductor packaging technologies, including TGV (Through Glass Via) glass substrates and silicon interposers. These technologies play a critical role in 3D integrated circuits and high-density packaging applications. The company has introduced multiple technological innovations in these fields and continues to provide customized solutions based on specific customer requirements and specifications.
Hot Products
Water-jet Laser Cutting and Drilling Machine
Water-jet Laser Cutting and Drilling Machine






Hortech collaborates with European manufacturers to introduce water-guided laser cutting systems that combine waterjet and laser technologies through a micro-jet nozzle. This hybrid process uses a hair-thin water jet to guide the laser beam via total internal reflection.
During processing, the water continuously cools the cutting zone while removing debris and particles, enabling true cold processing. Compared with conventional dry laser processing, water-guided laser technology minimizes thermal damage, deformation, oxidation, contamination, and microcracks.
By guiding the laser beam through the air-water interface, the system achieves high-precision cutting with smooth edges, high-aspect-ratio machining, and minimal heat-affected zones without complex focal distance control.
Traditional waterjet cutting is highly versatile and capable of processing metals, glass, stone, and other materials without thermal effects, while laser processing offers high-speed and highly automated manufacturing for precision applications. Water-guided laser technology combines the advantages of both methods, delivering clean, precise, and flexible processing for advanced manufacturing applications.
Compared with conventional laser systems, water-guided laser processing is especially suitable for heat-sensitive and high-reliability materials used in semiconductor, aerospace, advanced packaging, and precision industrial applications, where superior edge quality and minimal thermal impact are required.


#Water-Guided Laser Processing #Laser Micro-Cutting #Laser Micro-Drilling #High-Aspect-Ratio Vertical Holes #Vertical Precision Cutting #Advanced Semiconductor Packaging #Wafer Dicing #Diamond Cutting #Sapphire Cutting #ABF Ceramic Substrate Drilling #ABF Ceramic Substrate Cutting #Laser Via Formation #Laser Hole Drilling #AlSiC (Aluminum Silicon Carbide) Processing
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