Hortech was admitted to the Hsinchu Science Park in 2016. In its early stage, the company focused on the design and development of laser equipment systems. In 1989, it successfully developed carbon film resistor laser trimming equipment for a major PCB manufacturer, which was applied to memory modules.

In 2009, the company successfully developed a laser dry-process narrow-border circuit scribing system for touch panels, which was mass-produced and sold to leading global touch panel manufacturers.

In 2011, it developed a dual-stage touch panel film narrow-border circuit laser patterning system for a world-leading touch panel manufacturer, enabling higher-precision processing of flexible touch sensor substrates.

In 2015, the company successfully developed a 0.42 mm DITO glass laser patterning system, which was sold to a global navigation device manufacturer.

At the end of 2015, a 6 kW laser robotic additive system was delivered to the Laser Application Center of the Industrial Technology Research Institute (ITRI), Taiwan.

In 2017, the company developed a three-wavelength hybrid laser processing system for a Singapore-based client.

In 2018, it developed a medical PCB traceability laser marking system for a Taiwanese PCB manufacturer.

In 2025, the company achieved mass production of a hub-scale (rotary optical encoder) with an angular precision of 10 arcseconds.

Hortech is also actively involved in the development of advanced semiconductor packaging technologies, including TGV (Through Glass Via) glass substrates and silicon interposers. These technologies play a critical role in 3D integrated circuits and high-density packaging applications. The company has introduced multiple technological innovations in these fields and continues to provide customized solutions based on specific customer requirements and specifications.