Hortech Company
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886-35794266

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      • Micron-Scale Laser Technology
      • Wafer Fabrication & Advanced Semiconductor Packaging
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Products

  • Applications
    • Micron-Scale Laser Technology
      • Precision Laser Micro-Drilling
      • Micro-scale Laser Engraving
      • Precision Laser Micro-Etching
    • Wafer Fabrication & Advanced Semiconductor Packaging
      • Composite Ceramic ABF Substrate
      • GLASS WAFER
      • SIC wafer
      • Gas Distribution Plate
      • Molybdenum Microhole Plates
      • Profile Cutting of Carbon/Ceramic/Glass Fiber Composites
      • High-efficiency aluminum heat spreader
      • Indium Thermal Interface Material (sTIM)
      • DUV Applications
  • Laser Equipment
    • Water-jet Laser Cutting and Drilling Machine
    • Thin Film Laser Micro-Etching Equipment
    • Laser Micromachining
    • Laser Micro-Drilling Equipment
    • Green Laser Equipment
    • Desktop Laser Engraver
    • UV laser engraving module
    • CO2 Laser Engraving Machine
    • Laser Micromachining System / Equipment
  • Laser Processing Services
    • Precision Micro-Etching
      • Laser-engraved QR code
      • Micro-scale Laser Engraving
      • Laser-engraved Barcode
    • Rigid-Flex PCBs
      • Laser micro-etching on Nickel-Chromium coated ceramics
      • PI Laser Micro-drilling
    • Linear Encoders
      • Encoder disc
      • Stainless steel linear encoder
      • Stainless steel encoder disk
  • Automated Production Line Integration
    • Automated Production Line Installation and Engineering Services

Wafer Fabrication & Advanced Semiconductor Packaging

View:
Composite Ceramic ABF Substrate

Composite Ceramic ABF Substrate

GLASS WAFER

GLASS WAFER

SIC wafer

SIC wafer

Gas Distribution Plate

Gas Distribution Plate

Molybdenum Microhole Plates

Molybdenum Microhole Plates

Profile Cutting of Carbon/Ceramic/Glass Fiber Composites

Profile Cutting of Carbon/Ceramic/Glass Fiber Composites

High-efficiency aluminum heat spreader

High-efficiency aluminum heat spreader

Indium Thermal Interface Material (sTIM)

Indium Thermal Interface Material (sTIM)

DUV Applications

DUV Applications

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  • Hortech Company

TEL: 886-35794266

  • Address:1F., No. 13, Yanfa 2nd Rd., East Dist., Hsinchu City 30076, Taiwan
  • E-mail:e-sales@hortek.com.tw
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